Invention Grant
- Patent Title: Package structure and method of manufacturing the same
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Application No.: US17575659Application Date: 2022-01-14
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Publication No.: US12094852B2Publication Date: 2024-09-17
- Inventor: Ming-Fa Chen , Sung-Feng Yeh , Tzuan-Horng Liu , Chao-Wen Shih
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/367 ; H01L25/065
Abstract:
A package structure includes a first die, a die stack structure bonded to the first die, a support structure and an insulation structure. The support structure is disposed on the die stack structure, and a sidewall of the support structure is laterally shifted from a sidewall of the die stack structure. The insulation structure is disposed on the first die and laterally wraps around the die stack structure and the support structure.
Public/Granted literature
- US20220139882A1 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-05-05
Information query
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