Invention Grant
- Patent Title: Semiconductor element, semiconductor element preparing method, and solid state imaging apparatus
-
Application No.: US17613646Application Date: 2019-10-09
-
Publication No.: US12094898B2Publication Date: 2024-09-17
- Inventor: Shuyu Lei
- Applicant: Ningbo ABAX Sensing Electronic Technology Co., Ltd.
- Applicant Address: CN Ningbo
- Assignee: Ningbo ABAX Sensing Electronic Technology Co., Ltd.
- Current Assignee: Ningbo ABAX Sensing Electronic Technology Co., Ltd.
- Current Assignee Address: CN Ningbo
- Agency: Ziegler IP Law Group LLC.
- Priority: CN 1910473269.4 2019.05.31
- International Application: PCT/CN2019/110219 2019.10.09
- International Announcement: WO2020/237961A 2020.12.03
- Date entered country: 2021-11-23
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A semiconductor element, a semiconductor element preparing method, and a solid state imaging apparatus. The semiconductor element comprises: a group of first modulation grids, a group of second modulation grids, a semiconductor region, a first storage region, and a second storage region. The group of first modulation grids and the group of second modulation grids are respectively provided with different voltages, the potential of a signal charge transfer path in the semiconductor region is changed, and signal charges are controlled to move along a second direction; the first storage region is directly connected to the first modulation grids, so that when the voltage of the first storage region is higher than the voltage of the first modulation grids, and the first storage region attracts first signal charges retained in the first modulation grids.
Public/Granted literature
- US20220238581A1 SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT PREPARING METHOD, AND SOLID STATE IMAGING APPARATUS Public/Granted day:2022-07-28
Information query
IPC分类: