Invention Grant
- Patent Title: Image sensor assembly
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Application No.: US17631834Application Date: 2020-07-23
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Publication No.: US12094902B2Publication Date: 2024-09-17
- Inventor: Benjamin Hopp , Mike Pfeiffer
- Applicant: Leica Camera AG
- Applicant Address: DE Wetzlar
- Assignee: Leica Camera AG
- Current Assignee: Leica Camera AG
- Current Assignee Address: DE Wetzlar
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: DE 2019120668.5 2019.07.31
- International Application: PCT/EP2020/070798 2020.07.23
- International Announcement: WO2021/018726A 2021.02.04
- Date entered country: 2022-01-31
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G03B11/00
Abstract:
A sensor unit for an image recording device comprises an optoelectronic image sensor and a cover unit arranged in front of the optoelectronic image sensor. The cover unit comprises a first absorption glass and a second absorption glass, wherein the first absorption glass is configured as a UV absorption glass and the second absorption glass is configured as an IR absorption glass.
Public/Granted literature
- US20220278154A1 SENSOR UNIT Public/Granted day:2022-09-01
Information query
IPC分类:
