Invention Grant
- Patent Title: Method for structuring a semiconductor surface and semiconductor body comprising a semiconductor surface having at least one structure
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Application No.: US17439695Application Date: 2020-03-13
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Publication No.: US12094928B2Publication Date: 2024-09-17
- Inventor: Markus Tautz , Matthew John Davies , Martin Welzel
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE 2019106964.5 2019.03.19
- International Application: PCT/EP2020/056911 2020.03.13
- International Announcement: WO2020/187763A 2020.09.24
- Date entered country: 2021-09-15
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/306 ; H01L29/20 ; H01L29/66

Abstract:
In an embodiment a method for structuring a semiconductor surface includes providing the semiconductor surface, wherein the semiconductor surface is part of a GaN-semiconductor layer, irradiating the semiconductor surface with an electron beam in order to produce an irradiated section and anisotropic wet-chemical etching of the semiconductor surface, wherein an etching rate in the irradiated section is less than that in an unirradiated section of the semiconductor surface, and wherein no etching mask is applied to the semiconductor surface before anisotropic wet-chemical etching.
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