Invention Grant
- Patent Title: Method for manufacturing display substrate
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Application No.: US17771720Application Date: 2021-03-08
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Publication No.: US12094954B2Publication Date: 2024-09-17
- Inventor: Xinguo Wu , Fengguo Wang , Liang Tian , Yu Feng , Bin Liu , Chenglong Wang , Yuxuan Ma
- Applicant: Ordos Yuansheng Optoelectronics Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Inner Mongolia
- Assignee: Ordos Yuansheng G roni Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Ordos Yuansheng G roni Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Inner Mongolia; CN Beijing
- Agency: IPro, PLLC
- International Application: PCT/CN2021/079610 2021.03.08
- International Announcement: WO2022/188011A 2022.09.15
- Date entered country: 2022-04-25
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L23/48 ; H01L29/66 ; H01L29/786

Abstract:
A method for manufacturing a display substrate is provided. The method includes: forming a first active layer arranged in the NMOS transistor region and a second active layer arranged in the PMOS transistor region on the base substrate; coating one side, facing away from the base substrate, of the first active layer and one side, facing away from the base substrate, of the second active layer with a first photoresist layer, forming a first pattern layer by patterning the first photoresist layer to expose at least two ends of the first active layer; forming N-type heavily doped regions by performing N-type heavy doping on the two ends of the first active layer with the first pattern layer as a mask; forming a second pattern layer by processing the first pattern layer to expose at least a middle region of the first active layer.
Public/Granted literature
- US20230163200A1 METHOD FOR MANUFACTURING DISPLAY SUBSTRATE Public/Granted day:2023-05-25
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