A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The lead frame includes leads that have contact arms that are vertically offset from each other. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.