Invention Grant
- Patent Title: Transversely-excited film bulk acoustic resonator package and method
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Application No.: US17497961Application Date: 2021-10-10
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Publication No.: US12095448B2Publication Date: 2024-09-17
- Inventor: Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ARENTFOX SCHIFF LLP
- The original application number of the division: US16841134 2020.04.06
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/02 ; H03H9/10 ; H03H9/58 ; H03H9/64

Abstract:
Methods of making acoustic resonator devices and filters are disclosed. A method of fabricating an acoustic resonator device includes fabricating an acoustic resonator chip including: attaching a back surface of a piezoelectric plate to a front surface of a substrate, such that portions of the piezoelectric plate form at least first and second diaphragms spanning at least first and second cavities, and forming a first conductor pattern as one or more conductor layers on the piezoelectric plate. The first conductor pattern includes at least first and second interdigitated transducers (IDTs) and a first plurality of contact pads. The method further includes fabricating an interposer having front and back surface and a second plurality of contact pads on the interposer back surface, forming conductive balls, and bonding each of the first plurality of contact pads to a respective pad of the second plurality of contact pads using the respective conductive ball.
Public/Granted literature
- US20220029609A1 TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD Public/Granted day:2022-01-27
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