Invention Grant
- Patent Title: Integrated circuit with radio frequency interconnect
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Application No.: US18190881Application Date: 2023-03-27
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Publication No.: US12095711B2Publication Date: 2024-09-17
- Inventor: Huan-Neng Chen , William Wu Shen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Tze-Chiang Huang , Jack Liu , Yun-Han Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H04J3/00
- IPC: H04J3/00 ; H04L5/14 ; H04W52/02

Abstract:
An integrated circuit includes first through fourth devices positioned over one or more substrates, a first radio frequency interconnect (RFI) including a first transmitter included in the first device, a first receiver included in the second device, and a first guided transmission medium coupled to each of the first transmitter and the first receiver, a second RFI including a second transmitter included in the first device, a second receiver included in the third device, and a second guided transmission medium coupled to each of the second transmitter and the second receiver, and a third RFI including a third transmitter included in the first device, a third receiver included in the fourth device, and the second guided transmission medium coupled to each of the third transmitter and the third receiver.
Public/Granted literature
- US20230239129A1 INTEGRATED CIRCUIT WITH RADIO FREQUENCY INTERCONNECT Public/Granted day:2023-07-27
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