Invention Grant
- Patent Title: Bone conduction earphone and method for assembling bone conduction earphone
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Application No.: US17939884Application Date: 2022-09-07
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Publication No.: US12096173B2Publication Date: 2024-09-17
- Inventor: Hongbin Cao , Jialong Shen , Juan Chen
- Applicant: Suzhou Thor Electronic Technology Co., Ltd.
- Applicant Address: CN Jiangsu
- Assignee: Suzhou Thor Electronic Technology Co., Ltd.
- Current Assignee: Suzhou Thor Electronic Technology Co., Ltd.
- Current Assignee Address: CN Jiangsu
- Agency: JCIPRNET
- Priority: CN 2111101484.5 2021.09.18
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
The application discloses a bone conduction earphone and a method for assembling bone conduction earphone. The bone conduction earphone includes: a first bone conduction acoustic device; a second bone conduction acoustic device; the control compartment, which includes a main control board for controlling the first bone conduction acoustic device and the second bone conduction acoustic device; and the battery compartment, which includes a power supply for supplying power to the first bone conduction acoustic device, the second bone conduction acoustic device and the main control board. The bone conduction earphone of the present application has a more compact structure and a more convenient and efficient assembly.
Public/Granted literature
- US20230087039A1 BONE CONDUCTION EARPHONE AND METHOD FOR ASSEMBLING BONE CONDUCTION EARPHONE Public/Granted day:2023-03-23
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