Invention Grant
- Patent Title: Circuit board, circuit board assembly and electronic device
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Application No.: US17814804Application Date: 2022-07-25
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Publication No.: US12096559B2Publication Date: 2024-09-17
- Inventor: Ning Hao
- Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Current Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: McCoy Russell LLP
- Priority: CN 2210333680.3 2022.03.30
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11
Abstract:
A first circuit board includes: at least two supporting portions, where two adjacent supporting portions are movably connected; and a circuit layer formed on each of the supporting portions, where the circuit layers on the two adjacent supporting portions are electrically connected; and where the at least two supporting portions are configured to form a bending region of the circuit board.
Public/Granted literature
- US20230319994A1 CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE Public/Granted day:2023-10-05
Information query
