Invention Grant
- Patent Title: Nanocomposite material for ultraviolet curable direct write semiconductor applications
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Application No.: US17515870Application Date: 2021-11-01
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Publication No.: US12096561B2Publication Date: 2024-09-17
- Inventor: Craig A. Armiento , Yuri Piro , Andrew M. Luce , Emily Lamport , Oshadha Ranasingha , Christopher R. Areias , Christopher N. Kuncho , Alkim Akyurtlu , Edward D. Kingsley
- Applicant: Raytheon Company , The University of Massachusetts
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY,THE UNIVERSITY OF MASSACHUSETTS
- Current Assignee: RAYTHEON COMPANY,THE UNIVERSITY OF MASSACHUSETTS
- Current Assignee Address: US MA Waltham; US MA Lowell
- Agency: CANTOR COLBURN LLP
- Main IPC: H05K1/18
- IPC: H05K1/18 ; C09D11/037 ; C09D11/101 ; C09D11/102 ; H05K3/30
Abstract:
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
Public/Granted literature
- US20230139276A1 NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICONDUCTOR APPLICATIONS Public/Granted day:2023-05-04
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