Invention Grant
- Patent Title: Reciprocal PCB manufacturing process
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Application No.: US16157185Application Date: 2018-10-11
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Publication No.: US12096566B2Publication Date: 2024-09-17
- Inventor: Tyler Leuten
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/11 ; H05K1/18

Abstract:
Embodiments disclosed herein include a printed circuit board (PCB) with a non-uniform thickness and methods of fabricating such PCBs. In an embodiment, the PCB comprises a connector region with a top surface and a bottom surface, and a component region with a top surface and a bottom surface. In an embodiment, the bottom surface of the connector region is coplanar with the bottom surface of the component region. In an embodiment the top surface of the connector region is not coplanar with the top surface of the component region.
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