Invention Grant
- Patent Title: Manufacturing method of insulated metal substrate
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Application No.: US17078108Application Date: 2020-10-23
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Publication No.: US12096569B2Publication Date: 2024-09-17
- Inventor: Chun-Ta Yeh , Kuo-Pin Cheng , Chin-Long Lin
- Applicant: Jentech Precision Industrial Co., LTD.
- Applicant Address: TW Taoyuan
- Assignee: Jentech Precision Industrial Co., LTD.
- Current Assignee: Jentech Precision Industrial Co., LTD.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW 8101055 2019.01.10
- The original application number of the division: US16711450 2019.12.12
- Main IPC: H05K3/44
- IPC: H05K3/44 ; H01L21/48 ; H01L23/367 ; H05K1/05 ; H05K3/10 ; H05K3/20 ; H05K3/46 ; H05K1/02

Abstract:
An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.
Public/Granted literature
- US20210045240A1 MANUFACTURING METHOD OF INSULATED METAL SUBSTRATE Public/Granted day:2021-02-11
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