A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.