Invention Grant
- Patent Title: Heat sink assembly and control method for heat sink assembly, and electronic device and manufacturing method for electronic device
-
Application No.: US17144605Application Date: 2021-01-08
-
Publication No.: US12096599B2Publication Date: 2024-09-17
- Inventor: Yiwei Guo
- Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Current Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Cooper Legal Group, LLC
- Priority: CN 2010620369.8 2020.06.30
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01F7/06 ; H05K5/02

Abstract:
The present disclosure relates to a heat sink assembly and control method, and an electronic device and manufacturing method. The heat sink assembly includes: a vibrating plate including a magnetic material; a vibrating film, one end of which is connected with the vibrating plate; a driving device having an electromagnet, which is arranged opposite to the vibrating plate; a control circuit which is connected with the driving device and is configured for transmitting to the driving device a control signal for controlling the electromagnet to be energized and de-energized. The electromagnet generates a magnetic field that drives the vibrating plate to vibrate when the electromagnet is alternately switched between an energized state and a de-energized state. The vibrating film vibrates with the vibration of the vibrating plate.
Public/Granted literature
Information query