Invention Grant
- Patent Title: Resistive random access memory device
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Application No.: US18232750Application Date: 2023-08-10
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Publication No.: US12096706B2Publication Date: 2024-09-17
- Inventor: Huei-Tsz Wang , Po-Shu Wang , Wei-Ming Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- The original application number of the division: US15908601 2018.02.28
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10B61/00 ; H10B63/00 ; H10N50/85 ; H10N70/20 ; H01L23/528 ; H01L23/532 ; H01L23/544 ; H10N50/80

Abstract:
A memory cell includes: a first contact feature partially embedded in a first dielectric layer; a barrier layer, lining the first contact feature, that comprises a first portion disposed between the first contact feature and first dielectric layer, and a second portion disposed above the first dielectric layer; a resistive material layer disposed above the first contact feature, the resistive material layer coupled to the first contact feature through the second portion of the barrier layer; and a second contact feature embedded in a second dielectric layer above the first dielectric layer.
Public/Granted literature
- US20230397512A1 NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE Public/Granted day:2023-12-07
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