Invention Grant
- Patent Title: Modular adhesive dispensing device
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Application No.: US17761798Application Date: 2020-09-18
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Publication No.: US12103033B2Publication Date: 2024-10-01
- Inventor: Robert J. Woodlief , David R. Jeter , Brian R. Sosebee , Leonard J. Lanier , Enes Ramosevac , Peter W. Estelle , Jeffrey E. Owen , James R. Beal , Leslie J. Varga , John Daniels , Ronald M. Ramspeck , John M. Riney
- Applicant: Nordson Corporation
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: BakerHostetler
- International Application: PCT/US2020/051398 2020.09.18
- International Announcement: WO2021/055680A 2021.03.25
- Date entered country: 2022-03-18
- Main IPC: B05C5/02
- IPC: B05C5/02 ; B05C11/10 ; B29B13/02

Abstract:
An adhesive dispensing device (10) includes a melt module (12) including a housing (78) that defines a receiving space to receive adhesive and a heater (114) to heat the housing to melt the adhesive, and a control module (14) releasably connected to the melt module. The control module includes a controller (36) to automatically recognize a characteristic associated with the melt module and operate the melt module using instructions stored on the controller that correspond to the characteristic of the melt module. A method of operating the adhesive dispensing device is also disclosed.
Public/Granted literature
- US20220339662A1 MODULAR ADHESIVE DISPENSING DEVICE Public/Granted day:2022-10-27
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