Invention Grant
- Patent Title: Vacuum-assisted printing for porous substrates
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Application No.: US17905725Application Date: 2020-03-11
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Publication No.: US12103309B2Publication Date: 2024-10-01
- Inventor: Maria Elizabeth Zapata , Raimon Castells de Monet , Francisco Lopez Moral
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Jordan IP Law, LLC
- International Application: PCT/US2020/022077 2020.03.11
- International Announcement: WO2021/183123A 2021.09.16
- Date entered country: 2022-09-06
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
It is hereby disclosed a method to print on porous substrate by a printer comprising: a print zone; a conveyor to receive a porous substrate on a loading zone and to move the porous substrate along a transport direction between the print zone and the loading zone; a print engine positioned on the print zone for ejecting printing fluid towards the porous substrate; wherein the method comprises ejecting printing fluid towards a front side the porous substrate and, by a controller, activating a vacuum source as to exert a vacuum on a back side of the porous substrate being the vacuum exerted while the porous substrate is within the print zone.
Information query
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