Invention Grant
- Patent Title: Thermal management system
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Application No.: US17546044Application Date: 2021-12-08
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Publication No.: US12103353B2Publication Date: 2024-10-01
- Inventor: Junqi Dong
- Applicant: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.
- Applicant Address: CN Hangzhou
- Assignee: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.
- Current Assignee: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.
- Current Assignee Address: CN Hangzhou
- Agent Cheng-Ju Chiang
- Priority: CN 1911042175.8 2019.10.30
- Main IPC: B60H1/32
- IPC: B60H1/32 ; B60H1/00 ; B60H1/22

Abstract:
A thermal management system includes a refrigerant flow path, a coolant liquid flow path, a first heat exchanger and a second heat exchanger. The refrigerant flow path includes a compressor, a first indoor heat exchanger, a first flow regulation device, and a second flow regulation device. The coolant liquid flow path includes a first heat exchange assembly and a heater. The first heat exchanger includes a first heat exchange portion and a second heat exchange portion. The second heat exchanger includes a third heat exchange portion and a fourth heat exchange portion. The thermal management system has a first heating mode and a second heating mode. The thermal management system provides thermal energy required for heating by at least one of the following selectable processes: heating of the heater, and generating excess heat during operation of the first heat exchange assembly.
Public/Granted literature
- US20220097478A1 THERMAL MANAGEMENT SYSTEM Public/Granted day:2022-03-31
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