Invention Grant
- Patent Title: Compound, thin-film forming raw material that contains said compound, and method of manufacturing thin film
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Application No.: US17771181Application Date: 2020-10-19
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Publication No.: US12104245B2Publication Date: 2024-10-01
- Inventor: Atsushi Sakurai , Masako Hatase , Masaki Enzu , Keisuke Takeda , Ryota Fukushima , Atsushi Yamashita
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 19199862 2019.11.01
- International Application: PCT/JP2020/039239 2020.10.19
- International Announcement: WO2021/085210A 2021.05.06
- Date entered country: 2022-04-22
- Main IPC: C23C16/18
- IPC: C23C16/18 ; C07D487/10 ; C07F1/00 ; C07F3/00 ; C07F7/22 ; C07F13/00 ; C07F15/04 ; C07F15/06 ; C23C16/455
Abstract:
Provided is a thin-film forming raw material containing a compound represented by the following formula (1):
in the formula (1), R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a group containing a fluorine atom, M represents a metal atom, and “n” represents a valence of the metal atom represented by M, provided that at least one of R2, R3, and R4 represents the group containing a fluorine atom.
in the formula (1), R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a group containing a fluorine atom, M represents a metal atom, and “n” represents a valence of the metal atom represented by M, provided that at least one of R2, R3, and R4 represents the group containing a fluorine atom.
Public/Granted literature
Information query
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