Invention Grant
- Patent Title: Sound insulation structure of partition wall and method for constructing partition wall
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Application No.: US17792830Application Date: 2021-01-26
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Publication No.: US12104374B2Publication Date: 2024-10-01
- Inventor: Miki Okumura , Hideo Nagamatsu
- Applicant: SEKISUI HOUSE, LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI HOUSE, LTD.
- Current Assignee: SEKISUI HOUSE, LTD.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 20012618 2020.01.29
- International Application: PCT/JP2021/002549 2021.01.26
- International Announcement: WO2021/153535A 2021.08.05
- Date entered country: 2022-07-14
- Main IPC: E04B2/74
- IPC: E04B2/74 ; E04B1/82 ; E04B1/84 ; E04B2/58 ; E04B2/82

Abstract:
A partition wall sound insulation structure includes: a floor material on which a floor surface facing an indoor space side is formed; a ceiling material on which a ceiling surface is formed, the ceiling surface being opposed to the floor surface in a vertical direction with an indoor space interposed therebetween; a partition wall that extends in the vertical direction so as to partition the indoor space in a horizontal direction and that is disposed with a gap from at least one surface of the floor surface and the ceiling surface; and a sound insulation material made from an elastic material and including a portion disposed in the gap while being compressed in the vertical direction.
Public/Granted literature
- US20230044172A1 SOUND INSULATION STRUCTURE OF PARTITION WALL AND METHOD FOR CONSTRUCTING PARTITION WALL Public/Granted day:2023-02-09
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