Invention Grant
- Patent Title: Sensor device
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Application No.: US17756409Application Date: 2020-11-12
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Publication No.: US12104925B2Publication Date: 2024-10-01
- Inventor: Moriyuki Shimizu , Kyungwoo Kim , Toshinari Kobayashi , Hironobu Yamamoto , Yukitoshi Terasaka
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi
- Agency: Honigman LLP
- Priority: JP 19214318 2019.11.27
- International Application: PCT/JP2020/042241 2020.11.12
- International Announcement: WO2021/106598A 2021.06.03
- Date entered country: 2022-05-24
- Main IPC: G01D11/24
- IPC: G01D11/24
Abstract:
An object of the present disclosure is to improve the resistance of a sensor device to external damage. A sensor device includes a sensor element, and a resin cover part that covers the sensor element, wherein at least a portion of a surface of the resin cover part is cross-linked.
Public/Granted literature
- US20230003559A1 SENSOR DEVICE Public/Granted day:2023-01-05
Information query
