A camera device connection structure includes a circuit board, a lens assembly and a case assembly. The lens assembly is disposed on upper side of the circuit board and has a first mating section and a second mating section respectively disposed on two opposite sides of the lens assembly. The case assembly has a first case body and a second case body. The first and second case bodies are disposed on the upper side of the circuit board and respectively positioned on two sides of the lens assembly. The first and second case bodies respectively have a first connection section and a second connection section corresponding to the lens assembly. The first and second connection sections are respectively connected with the first and second mating sections of the lens assembly, whereby the structural strength of the camera device can be still enhanced in precondition that the camera device is thinned.