Invention Grant
- Patent Title: Equipment front end module
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Application No.: US18332314Application Date: 2023-06-09
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Publication No.: US12106989B2Publication Date: 2024-10-01
- Inventor: Bum Je Woo
- Applicant: PICO & TERA CO., LTD. , Bum Je Woo
- Applicant Address: KR Suwon
- Assignee: PICO & TERA CO., LTD.
- Current Assignee: PICO & TERA CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR 20200138086 2020.10.23
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/67 ; H01L21/677
Abstract:
Proposed is an EFEM configured to perform wafer transfer between a wafer storage device and process equipment. More particularly, proposed is an EFEM that prevents harmful gases inside a transfer chamber in which wafer transfer is performed from escaping out of the EFEM.
Public/Granted literature
- US20230317486A1 EQUIPMENT FRONT END MODULE Public/Granted day:2023-10-05
Information query
IPC分类:
