Invention Grant
- Patent Title: Method for manufacturing semiconductor structure with dielectric feature
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Application No.: US17395678Application Date: 2021-08-06
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Publication No.: US12107006B2Publication Date: 2024-10-01
- Inventor: Jia-Chuan You , Chia-Hao Chang , Kuan-Ting Pan , Shi-Ning Ju , Kuo-Cheng Chiang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a substrate and nanostructures formed over the substrate. The semiconductor structure also includes a gate structure wrapping around the nanostructures and a first dielectric feature separating the gate structure into a first portion and a second portion. The semiconductor structure also includes a metal layer formed over the gate structure. In addition, top surfaces of the first portion and the second portion of the gate structure and a top surface of the first dielectric feature are covered by the metal layer.
Public/Granted literature
- US20220399231A1 SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-12-15
Information query
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