Invention Grant
- Patent Title: Semiconductor packages
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Application No.: US18163252Application Date: 2023-02-01
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Publication No.: US12107038B2Publication Date: 2024-10-01
- Inventor: Shu-Jung Tseng , Fu-Jen Li
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A semiconductor package includes an interposer, a die and a first encapsulant. The die is bonded to the interposer, the die has a protective layer thereon, wherein the protective layer and the interposer are disposed on opposite sides of the die, and the protective layer is not extended beyond an outer sidewall of the die. The first encapsulant is disposed aside the die and the protective layer.
Public/Granted literature
- US20230170291A1 SEMICONDUCTOR PACKAGES Public/Granted day:2023-06-01
Information query
IPC分类:
