Invention Grant
- Patent Title: Hybrid bonded interconnect bridging
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Application No.: US18324744Application Date: 2023-05-26
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Publication No.: US12107075B2Publication Date: 2024-10-01
- Inventor: Lei Fu , Brett P. Wilkerson , Rahul Agarwal
- Applicant: ADVANCED MICRO DEVICES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L23/538
Abstract:
A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.
Public/Granted literature
- US20230387076A1 HYBRID BONDED INTERCONNECT BRIDGING Public/Granted day:2023-11-30
Information query
IPC分类:
