- Patent Title: Infrared detector with multi-layer structure based on CMOS process
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Application No.: US18562284Application Date: 2022-03-24
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Publication No.: US12107111B2Publication Date: 2024-10-01
- Inventor: Guangjie Zhai , Pei Wu , Hui Pan , Guangqiang Zhai
- Applicant: Beijing North Gaoye Technology Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing North Gaoye Technology Co., Ltd.
- Current Assignee: Beijing North Gaoye Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Jaffery Watson Hamilton & DeSanctis LLP
- Priority: CN 2110711253.X 2021.06.25
- International Application: PCT/CN2022/082854 2022.03.24
- International Announcement: WO2022/267584A 2022.12.29
- Date entered country: 2023-11-17
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.
Public/Granted literature
- US20240243160A1 AN INFRARED DETECTOR WITH MULTI-LAYER STRUCTURE BASED ON CMOS PROCESS Public/Granted day:2024-07-18
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