Invention Grant
- Patent Title: Robust interface for cooler to housing
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Application No.: US17217480Application Date: 2021-03-30
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Publication No.: US12107248B2Publication Date: 2024-10-01
- Inventor: Helmut Rath
- Applicant: Samsung SDI Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: LEWIS ROCA ROTHGERBER CHRISTIE LLP
- Priority: EP 166991 2020.03.31 KR 20210040390 2021.03.29
- Main IPC: H01M10/6568
- IPC: H01M10/6568 ; B60K1/04 ; B60L50/64 ; H01M10/613 ; H01M10/625 ; H01M10/6556 ; H01M10/6557 ; H01M10/6567 ; H01M50/207 ; H01M50/249 ; H01M50/60 ; B60K1/00 ; B60K11/02 ; F16L5/02 ; F16L21/03

Abstract:
An interface system for mechanically decoupling a cooling system includes: a housing having an opening; an inset having opposite first and second sides; an interface body having first and second ends and a bore-hole open to the first and second ends thereof. The inset has a recess in the second side to accommodate the interface body. The interface body is at least partially inserted into the inset, and the inset is at least partially inserted into the opening in the housing such that the first side of the inset is inside the housing. The first side of the inset has an opening open to the bore-hole of the interface body. One end of the bore-hole is configured to slidably receive an inlet of a cooling pipe, and the other end of the bore-hole is configured to be connected, in a fluid-tight manner, with an external coolant supply or coolant discharge.
Public/Granted literature
- US20210305643A1 ROBUST INTERFACE FOR COOLER TO HOUSING Public/Granted day:2021-09-30
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