Invention Grant
- Patent Title: Combining power amplifers at milimeter wave frequencies
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Application No.: US17515695Application Date: 2021-11-01
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Publication No.: US12107558B2Publication Date: 2024-10-01
- Inventor: Krishnanshu Dandu , Brian Paul Ginsburg
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michael T. Gabrik; Frank D. Cimino
- Main IPC: H03F3/68
- IPC: H03F3/68 ; G01S7/03 ; G01S13/931 ; H01Q1/32 ; H01Q21/08 ; H03F3/195 ; H03F3/21 ; H03F3/24 ; H03F3/45 ; H03G3/30 ; H01Q9/06 ; H03H7/48 ; H04B1/04

Abstract:
A system having a set of power amplifiers each having a primary inductive structure configured to provide an output signal. A secondary inductive structure is configured to inductively couple to each of the primary inductive structures. A transmission line is provided with a signal trace and a ground trace. The signal trace of the transmission line is connected to a first end of the secondary inductive structure. A return path from a second end of the secondary inductive structure is coupled via a resonant network to the ground trace of the transmission line, in which the return path is spaced away from the secondary inductive structure to minimize inductive coupling to the primary structures.
Public/Granted literature
- US20220060161A1 COMBING POWER AMPLIFERS AT MILIMETER WAVE FREQUENCIES Public/Granted day:2022-02-24
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