Invention Grant
- Patent Title: High frequency module and communication apparatus
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Application No.: US17661586Application Date: 2022-05-02
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Publication No.: US12107616B2Publication Date: 2024-10-01
- Inventor: Katsunari Nakazawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 19223229 2019.12.10
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H03F3/21 ; H03F3/24 ; H04B1/04

Abstract:
A power amplifier is capable of operating in a first power mode and a second power mode with a gain lower than a gain of the first power mode. The power amplifier is connected to a first common terminal of the first switch. Two or more filters are connected to two or more first selection terminals other than at least one first selection terminal among three or more first selection terminals of the first switch. The at least one first selection terminal of the first switch and at least one second selection terminal of a second switch are connected. The first switch is capable of switching between a first path passing through at least one of the two or more filters and a second path not passing through any of the two or more filters but passing through the at least one first selection terminal.
Public/Granted literature
- US20220263533A1 HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2022-08-18
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