Invention Grant
- Patent Title: Electronic device including hinge module
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Application No.: US17701858Application Date: 2022-03-23
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Publication No.: US12108550B2Publication Date: 2024-10-01
- Inventor: Chanhee Oh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20210021670 2021.02.18
- Main IPC: H05K5/00
- IPC: H05K5/00 ; F16C11/04 ; H05K5/02

Abstract:
According to an embodiment, an electronic device may include a first housing, a second housing, a hinge device configured to connect the first housing and the second housing to be foldable about a folding axis, and a flexible display arranged to be supported by at least a part of the first housing, the second housing, and the hinge device. The hinge device may include a hinge housing including an accommodation portion, at least one cam assembly arranged in the accommodation portion, at least two coil spring members providing a pressing force to the at least one cam assembly in a direction parallel to the folding axis, and at least one hinge plate configured to support the at least one cam assembly. The at least two coil spring members may be coiled in opposite directions. Various other embodiments may be possible.
Public/Granted literature
- US20220264756A1 ELECTRONIC DEVICE INCLUDING HINGE MODULE Public/Granted day:2022-08-18
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