Invention Grant
- Patent Title: Interconnecting module configured for interconnecting computing units in a HPC cabinet and a method for engaging said interconnecting module
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Application No.: US17707919Application Date: 2022-03-29
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Publication No.: US12108555B2Publication Date: 2024-10-01
- Inventor: Sakthivel Mohanasundaram , Vishwas Bs
- Applicant: BULL SAS
- Applicant Address: FR Les Clayes-sous-Bois
- Assignee: BULL SAS
- Current Assignee: BULL SAS
- Current Assignee Address: FR Les Clayes-sous-Bois
- Agency: ARC IP Law, PC
- Agent Joseph J. Mayo
- Priority: EP 166863 2021.04.04
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K5/00 ; H05K5/02

Abstract:
An interconnecting module configured to be mounted in a High-Performance Computing (HPC) cabinet in order to interconnect a plurality of computing units located in the HPC cabinet. The interconnecting module comprising a chassis configured to be mounted horizontally within housings defined in the computing units, a plurality of connection units spaced vertically, each connection unit being configured to be connected to a motherboard of a computing unit, the connection units being interconnected, each connection unit comprising at least a fastening member configured to cooperate with a housing of a computing unit, a vertical rack cooperating with all the fastening members and at least a main lever mounted pivotally on the chassis, the main lever being configured to move the vertical rack vertically in order to engage/disengage all the fastening members simultaneously.
Public/Granted literature
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