Invention Grant
- Patent Title: Electronic apparatus and cooling module
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Application No.: US17932720Application Date: 2022-09-16
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Publication No.: US12108561B2Publication Date: 2024-10-01
- Inventor: Junki Hashiba , Masahiro Kitamura , Shunsuke Mashimo
- Applicant: LENOVO (SINGAPORE) PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: LENOVO (SINGAPORE) PTE. LTD.
- Current Assignee: LENOVO (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: SHIMOKAJI IP
- Priority: JP 21200340 2021.12.09
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
Public/Granted literature
- US20230189471A1 ELECTRONIC APPARATUS AND COOLING MODULE Public/Granted day:2023-06-15
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