Invention Grant
- Patent Title: Direct cooling of a power converter by using a stamped plate
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Application No.: US17435489Application Date: 2020-02-27
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Publication No.: US12108580B2Publication Date: 2024-10-01
- Inventor: Thomas Gradinger , Andreas Apelsmeier , Benjamin Söhnle , Daniele Torresin
- Applicant: AUDI AG , Hitachi Energy Ltd
- Applicant Address: DE Ingolstadt
- Assignee: AUDI AG,Hitachi Energy Ltd
- Current Assignee: AUDI AG,Hitachi Energy Ltd
- Current Assignee Address: DE Ingolstadt; CH Zurich
- Agency: Maier & Maier, PLLC
- Priority: DE 2019202902.7 2019.03.04
- International Application: PCT/EP2020/055139 2020.02.27
- International Announcement: WO2020/178131A 2020.09.10
- Date entered country: 2021-09-01
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473
Abstract:
A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.
Public/Granted literature
- US12160982B2 Direct cooling of a power converter by using a stamped plate Public/Granted day:2024-12-03
Information query
