Invention Grant
- Patent Title: Curable silicone composition, encapsulant and optical semiconductor device
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Application No.: US17387573Application Date: 2021-07-28
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Publication No.: US12110412B2Publication Date: 2024-10-08
- Inventor: Akito Hayashi , Sawako Horie
- Applicant: DuPont Toray Specialty Materials Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: DuPont Toray Specialty Materials Kabushiki Kaisha
- Current Assignee: DuPont Toray Specialty Materials Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP 20144458 2020.08.28
- Main IPC: C09D183/04
- IPC: C09D183/04 ; C08G77/08 ; C08G77/12 ; H01L23/29 ; H01L33/56

Abstract:
A curable silicone composition is capable of forming a cured product having excellent elongation characteristics.
The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I):
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.
The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I):
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.
Public/Granted literature
- US20220064380A1 CURABLE SILICONE COMPOSITION, ENCAPSULANT AND OPTICAL SEMICONDUCTOR DEVICE Public/Granted day:2022-03-03
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