Curable silicone composition, encapsulant and optical semiconductor device
Abstract:
A curable silicone composition is capable of forming a cured product having excellent elongation characteristics.
The curable silicone composition, comprises: (A) a resinous alkenyl group-containing organopolysiloxane containing less than two alkenyl groups per molecule on average, which is represented by average unit formula (I):



(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where in formula (I), each R1 is independently a monovalent hydrocarbon group including an alkenyl group, while the number of alkenyl groups per molecule is less than two on average, X is a hydrogen atom or an alkyl group, 0≤a≤1, 0≤b≤1, 0≤c 0; (B) an organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule; and (C) a curing reaction catalyst.
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