A LED chip transfer method comprises: providing a driving substrate having at least one set of binding points, the set of binding points comprising a first and second binding points; forming a compensation layer covering the first and second binding points; providing a chip substrate comprising a substrate and chips; performing a first alignment treatment to form a first groove and a second groove on the compensation layer; forming a first and second via holes spaced from each other by the first groove and the second groove, forming a first transfer electrode and a second transfer electrode disconnected from each other on the compensation layer, inserting the first pin and the second groove into the first groove and the second groove to bind with the first transfer electrode and the second transfer electrode; and stripping the substrate from the chip.