Invention Grant
- Patent Title: Fabrication of gate-all-around integrated circuit structures having additive metal gates
-
Application No.: US17031832Application Date: 2020-09-24
-
Publication No.: US12113068B2Publication Date: 2024-10-08
- Inventor: Dan S. Lavric , Dax M. Crum , Omair Saadat , Oleg Golonzka , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; B82Y10/00 ; H01L21/8238 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/40 ; H01L29/423 ; H01L29/66 ; H01L29/775 ; H01L29/786

Abstract:
Gate-all-around integrated circuit structures having additive metal gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, the first gate stack having a P-type conductive layer with a first portion surrounding the nanowires of the first vertical arrangement of horizontal nanowires and a second portion extending laterally beside and spaced apart from the first portion. A second gate stack is over the second vertical arrangement of horizontal nanowires, the second gate stack having an N-type conductive layer with a first portion surrounding the nanowires of the second vertical arrangement of horizontal nanowires and a second portion adjacent to and in contact with the second portion of the P-type conductive layer.
Public/Granted literature
- US20220093598A1 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADDITIVE METAL GATES Public/Granted day:2022-03-24
Information query
IPC分类: