Invention Grant
- Patent Title: Planar inductor and semiconductor chip
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Application No.: US17205805Application Date: 2021-03-18
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Publication No.: US12113095B2Publication Date: 2024-10-08
- Inventor: Xiaowei Zou , Chengbo Qiu , Haisheng Lu
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/00 ; H01L49/02

Abstract:
This application discloses a planar inductor. The planar inductor includes a first inductor module and a second inductor module that are connected in parallel. A direction of a magnetic line of the first inductor module is opposite to a direction of a magnetic line of the second inductor module, so that the magnetic lines can form a self-close loop in the planar inductor, and impact of a far magnetic field generated by the inductor on the outside, especially a nearby inductor, can be greatly reduced, thereby reducing crosstalk between the inductors, that is, reducing a phase noise, and increasing a Q value of the inductor. In addition, this application further provides a semiconductor chip that includes the planar inductor.
Public/Granted literature
- US20210210591A1 Planar Inductor and Semiconductor Chip Public/Granted day:2021-07-08
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