Invention Grant
- Patent Title: Semiconductor device with a core-shell feature and method for forming the same
-
Application No.: US17389142Application Date: 2021-07-29
-
Publication No.: US12113113B2Publication Date: 2024-10-08
- Inventor: Chih-Chung Chang , Sung-En Lin , Chung-Ting Ko , You-Ting Lin , Yi-Hsiu Liu , Po-Wei Liang , Jiun-Ming Kuo , Yung-Cheng Lu , Chi On Chui , Yuan-Ching Peng , Jen-Hong Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/786

Abstract:
A semiconductor device includes a pair of fin structures on a semiconductor substrate, each including a vertically stacked plurality of channel layers, a dielectric fin extending in parallel to and between the fin structures, and a gate structure on and extending perpendicularly to the fin structures, the gate structure engaging with the plurality of channel layers. The dielectric fin includes a fin bottom and a fin top over the fin bottom. The fin bottom has a top surface extending above a bottom surface of a topmost channel layer. The fin top includes a core and a shell, the core having a first dielectric material, the shell surrounding the core and having a second dielectric material different from the first dielectric material.
Public/Granted literature
- US20230029739A1 Semiconductor Device With A Core-Shell Feature And Method For Forming The Same Public/Granted day:2023-02-02
Information query
IPC分类: