Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17686809Application Date: 2022-03-04
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Publication No.: US12113126B2Publication Date: 2024-10-08
- Inventor: Kaori Fuse , Keiko Kawamura , Takako Motai , Tomoko Matsudai , Yoko Iwakaji
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP 21154468 2021.09.22
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/868

Abstract:
A semiconductor device includes: a first electrode; a first semiconductor layer of first conductivity type provided on the first electrode; a second semiconductor layer of second conductivity type provided on the first semiconductor layer; a second electrode provided on the second semiconductor layer; a first trench reaching the first semiconductor layer from the second semiconductor layer; a first semiconductor region provided in the second semiconductor layer, the first semiconductor region being in contact with the first trench and the first semiconductor region having a higher concentration of impurities of second conductivity type than the second semiconductor layer; and a first insulating film provided in the second semiconductor layer and the first insulating film being in contact with the first semiconductor region.
Public/Granted literature
- US20230086935A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-03-23
Information query
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