Invention Grant
- Patent Title: High speed sampling circuit
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Application No.: US18253050Application Date: 2021-03-24
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Publication No.: US12113536B2Publication Date: 2024-10-08
- Inventor: Guangyao You , Yuanjun Liang
- Applicant: SHENZHEN PANGO MICROSYSTEMS CO., LTD
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN PANGO MICROSYSTEMS CO., LTD
- Current Assignee: SHENZHEN PANGO MICROSYSTEMS CO., LTD
- Current Assignee Address: CN Shenzhen
- Agent Jeenam Park
- Priority: CN 2011390177.9 2020.12.01
- International Application: PCT/CN2021/082548 2021.03.24
- International Announcement: WO2022/116414A 2022.06.09
- Date entered country: 2023-05-16
- Main IPC: H03K3/02
- IPC: H03K3/02 ; G11C7/06 ; G11C27/02 ; H03K3/356 ; H03M1/12

Abstract:
A high-speed sampling circuit is disclosed which comprises a sampling module for amplifying a differential input signal; a latch module for latching the differential output signal of the sampling module; a first control module for controlling the sampling module under a first clock signal; a second control module for controlling the latch module under a second clock signal; a third control module for controlling control the output of the differential output signal under the second clock signal. The high-speed sampling circuit of the disclosure, after sampling the differential input signal, the sampling module outputs it to the latch module and controls the latch module to output the differential output signal, compared to the existing two-stage sampling module, it saves the transmission delay of the two-stage sampling module and can improve the performance of the high-speed sampling band of the signal.
Public/Granted literature
- US20230421142A1 HIGH SPEED SAMPLING CIRCUIT Public/Granted day:2023-12-28
Information query
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