Invention Grant
- Patent Title: Radio frequency module
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Application No.: US17088929Application Date: 2020-11-04
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Publication No.: US12113566B2Publication Date: 2024-10-08
- Inventor: Shou Matsumoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 18137535 2018.07.23
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H05K1/02

Abstract:
A radio frequency module includes a power amplification element, a transmission filter, and a transmission matching element, which are transmission-only components for processing only a transmission signal, a low noise amplification element, a reception filter, and a reception matching element, which are reception-only components for processing only a reception signal, an antenna switch, which is a transmission-reception dual-use component for processing both a transmission signal and a reception signal, and a first module board and a second module board, which are arranged to face each other. The transmission-only components are mounted on a main surface of the first module board, and the reception-only components and the transmission-reception dual-use component are mounted on respective main surfaces of the second module board.
Public/Granted literature
- US20210050876A1 RADIO FREQUENCY MODULE Public/Granted day:2021-02-18
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