The present disclosure provides a reinforcing part for a speaker diaphragm, the reinforcing part being an overlapped multilayer structure, the reinforcing part includes a heat dissipation layer as well as a first support layer and a second support layer that are fixed and bonded on surfaces of two sides of the heat dissipation layer respectively, and the first support layer and the second support layer each includes through holes penetrating the surfaces of two sides thereof, and the reinforcing part further includes fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.