Invention Grant
- Patent Title: Micro-ground vias for improved signal integrity for high-speed serial links
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Application No.: US17713347Application Date: 2022-04-05
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Publication No.: US12114419B2Publication Date: 2024-10-08
- Inventor: William Andrew Smith , Mallikarjun Vasa , Bhyrav M. Mutnury
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/42

Abstract:
An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
Public/Granted literature
- US20230319978A1 MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERIAL LINKS Public/Granted day:2023-10-05
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