Invention Grant
- Patent Title: Circuit board and probe card
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Application No.: US17796003Application Date: 2021-01-25
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Publication No.: US12114423B2Publication Date: 2024-10-08
- Inventor: Youichiro Honda , Yoshihiro Toda
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP 20013087 2020.01.30
- International Application: PCT/JP2021/002417 2021.01.25
- International Announcement: WO2021/153494A 2021.08.05
- Date entered country: 2022-07-28
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/073 ; H05K1/02 ; H05K1/11

Abstract:
A circuit board includes an insulating substrate having a first surface and a second surface opposite to the first surface, a solid conductor located inside the insulating substrate, a first via conductor connected to the solid conductor from a side of the first surface, and a second via conductor connected to the solid conductor from a side of the second surface. The solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other.
Public/Granted literature
- US20230076558A1 CIRCUIT BOARD AND PROBE CARD Public/Granted day:2023-03-09
Information query