Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing same
-
Application No.: US17669573Application Date: 2022-02-11
-
Publication No.: US12114485B2Publication Date: 2024-10-08
- Inventor: Qinghua Han
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Anhui
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2110808697.5 2021.07.16
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L29/10 ; H01L29/423 ; H01L29/786

Abstract:
Provided are a semiconductor structure and a method for manufacturing the same. The semiconductor structure includes: a base; a bit line; and a semiconductor channel including a first doped region, a channel region, and a second doped region that are sequentially arranged, where the first doped region contacts the bit line, and the first doped region, the channel region, and the second doped region are doped with first-type doped ions. The channel region is further doped with second-type doped ions, enabling a concentration of majority carriers in the channel region to be less than a concentration of majority carriers in the first doped region and a concentration of majority carriers in the second doped region. The first-type doped ions are one of N-type ions or P-type ions, and the second-type doped ions are the other of N-type ions or P-type ions.
Public/Granted literature
- US20230020711A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2023-01-19
Information query