Invention Grant
- Patent Title: Magnetoresistance memory device and method of manufacturing magnetoresistance memory device
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Application No.: US17465696Application Date: 2021-09-02
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Publication No.: US12114577B2Publication Date: 2024-10-08
- Inventor: Taichi Igarashi
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP 20156465 2020.09.17
- Main IPC: H10N50/80
- IPC: H10N50/80 ; H10B61/00 ; H10N50/01

Abstract:
In general, according to one embodiment, a magnetoresistance memory device includes: a first conductor; a second conductor on the first conductor; a first element on the second conductor; a third conductor on the first element; and a first layer stack on the third conductor. The second conductor is amorphous. The first element includes a silicon oxide introduced with a dopant. The first layer stack includes a first magnetic layer, a second magnetic layer, and a first insulating layer between the first magnetic layer and the second magnetic layer.
Public/Granted literature
- US20220085278A1 MAGNETORESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING MAGNETORESISTANCE MEMORY DEVICE Public/Granted day:2022-03-17
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