Invention Grant
- Patent Title: Enhancing interpolated thermal images
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Application No.: US17611284Application Date: 2019-09-26
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Publication No.: US12125187B2Publication Date: 2024-10-22
- Inventor: He Luan , Jun Zeng
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Shook, Hardy & Bacon L.L.P.
- International Application: PCT/US2019/053278 2019.09.26
- International Announcement: WO2021/061138A 2021.04.01
- Date entered country: 2021-11-15
- Main IPC: G06T3/4007
- IPC: G06T3/4007 ; B29C64/393 ; G06T7/00 ; B33Y50/02

Abstract:
An example three-dimensional (3D) printer may include a camera to capture a low-resolution thermal image of a build material bed. The 3D printer may include an interpolation engine to generate an interpolated thermal image based on the low-resolution thermal image. The 3D printer may also include a correction engine to enhance fine details of the interpolated thermal image without distorting thermal values from portions of the interpolated thermal image without fine details to produce an enhanced thermal image.
Public/Granted literature
- US20220215528A1 ENHANCING INTERPOLATED THERMAL IMAGES Public/Granted day:2022-07-07
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