Invention Grant
- Patent Title: Structure for multiple sense amplifiers of memory device
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Application No.: US17874973Application Date: 2022-07-27
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Publication No.: US12125551B2Publication Date: 2024-10-22
- Inventor: Ku-Feng Lin , Hiroki Noguchi
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C7/06 ; G11C11/16 ; G11C13/00

Abstract:
A memory device includes a plurality of sense amplifiers, a plurality of memory cells, a plurality of data lines, a plurality of reference cells, and a connection line. The memory cells are coupled to a plurality of first inputs of the plurality of sense amplifiers respectively. The data lines are coupled to a plurality of second inputs of the plurality of sense amplifiers respectively. The reference cells are arranged in a plurality of columns respectively and coupled to the plurality of data line respectively. Each of the plurality of reference cells includes a plurality of resistive elements. The connection line is coupled to the plurality of data lines. In a read mode, one of the sense amplifiers is configured to access the plurality of resistive elements arranged in at least one of the plurality of columns.
Public/Granted literature
- US20220358973A1 STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE Public/Granted day:2022-11-10
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